On 26 Sep 2006 17:15:35 -0700, "Telstar Electronics"
wrote in
. com:

Frank Gilliland wrote:
Wrong. The ceramic package isn't hollow; on the contrary, it contacts
more of the junction's surface area than the heat sink flange (which,
BTW, doesn't make "intimate contact" with any part of the junction
because it is insulated from the die by the Be Oxide substrate).


If the ceramic cap is tied so well to the heat source internal to the
transistor... then why don't you just attach the heat sink to the
ceramic caps on your new design?... LOL


Actually, that's not such a bad idea. Computer processors and other
chips are encased in ceramic and the heat sinks are typically mounted
on top. Having an additional heat sink on the top of the transistor
certainly can't hurt. I'll check into this and see if it's do-able.

Thanks, Brian!