On Wed, 28 Feb 2007 13:55:47 -0800, Jim Kelley
wrote:

What I meant was, in what way were you able to attribute and apportion
this heat to its various sources? What evidence were you able to
obtain to show reflected energy re-entering the source output? What
component in the system in fact dissipated the reflected energy? How
were you able to determine the exact source and amount of energy at
any given location within the source? Or did you just presume that
you understood the underlying mechanisms?

Hi Jim,

This knowledge arrived by many avenues.

For one, in a heavily heatsinked design, mapping of temperatures
generally reveal a very diffuse origin. That, of course, is the
purpose of the heatsink. So, in that regard the assignment of where
dissipation occurs is done by induction. You can eliminate a lot
circuitry as being incapable of supporting this dissipation, as it is
both remote from the signal path, and remote physically. The
literature of design reveals much of what is discovered in the field.

That literature reveals the dissipation occurs in the
emitter/collector junction of the finals' transistors. Failures have
been confirmed through post-mortem examination by microscope (no, I
have not done this).

Experience with new designs and frequency of failure (those activities
that I have participated in) lead to the same conclusion. In one
particular case it was a manufacturing/assembly problem of mounting
the transistor to the heatsink. A bur was found in many such mounts
that interfered with a complete mating of surfaces. This raised the
thermal resistance in the path from that same junction to the mating
surface, to the heatsink, to the environment. Knowing each thermal
resistance in that path makes it rather simple to forecast the
junction temperature at the time of failure (or rather, to say failure
which occurred was guaranteed a fatal temperature) when you know the
power consumed by the component. All such "resistance" conform to the
simple math of Ohm's law (once you substitute the necessary units for
heat).

When we return to the design guidelines and this junction, almost
every manufacturer of power transistors specifies a junction
resistance value at rated power. Casting this value through the chain
of transformations and to the antenna connector reveals a value very
nearly 50 Ohms. There are newer power amplification designs today,
and yet the market for Ham gear is dominated by the Class AB design
which is exhibits this property nicely.

Inductive logic leads us to this junction as the principle target of
reflected power (the signal path is symmetric, after all). Experience
has supported this logic. Failures are attributable to design flaw
(or assembly flaw), or poor application (driving a mismatch), or both.

As for tubes, I've already testified to the obvious location for
dissipation. It is far easier to see.

73's
Richard Clark, KB7QHC