Pete KE9OA wrote:

TenTec used hot melt glue in the VCO modules of the Paragon transceiver, so
this glue probably has good RF characteristics (hopefully).

A way to test hot melt glue would be to place a small piece on a paper
plate in the microwave oven, along with a cup of coffee to the side (as
a dummy load to keep the oven happy). See if it gets warm.

Has anyone attempted to use good old fashioned hot melt glue as an
encapsulant for modules ?

Probably needs melting in a pot over a flame (with appropriate care).

A double boiler set up may be better for that.




Both of these options seem significantly less expensive than standard
epoxy potting compound...

I suppose an advantage of hot melt glue is that you could de-encapsulate
stuff easier if you ever needed to.