On 6/20/2014 10:55 AM, Rob wrote:
Percy Picacity wrote:
I believe stencilling on solder paste, robot placement of components,
and melting the whole board in a reflow-like process with an accurately
controlled temperature vs. time profile is pretty standard for
complicated multilayer boards nowadays.

You are not going to convince Jerry once he has one of his usual
twisted views on reality...


I'm not going to be convinced I haven't seen what I have seen.

You really need to get out more. Try visiting some assembly plants in
person, for instance - instead of relying on hearsay.

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Jerry Stuckle

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