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![]() "zindazenda" wrote in message ... "Allan Butler" wrote in message news:ALRjc.5600$Rd4.566539@attbi_s51... What I have done in the past is to tin the pads where the parts are going to be mounted and then I use two soldering irons. One on each pad and it pulls the part right down into a good position. Ok ok I hear the question now. What about parts with more than two leads? That is a valid and good question. Only tin two pads for that part and use the soldering iron on each one of the pads to get the part mounted and in position to finish soldering the rest of the leads one at a time. no..on investugation this looks well abit crap..i cant see how it is going to work with 100 sm 0805 components.. so anyother ideas.. can one buy flow soldering equipment s/h??? g0zen.. Actually, for the occasional prototype, the two-iron method, while a bit tedious, works. (and while 0402 parts are a bit of a bear, even with my aging vision I can handle 0805's and 0603's with this method ... but it takes time and patience and I don't like to do a *lot* of parts that way) You can also, with a bit of practice and care, use a "heat gun" to reflow boards if you don't envision doing enough of it to justify the cost of "real" reflow equipment. I purchased a very nice and effective hot-air system for about $350 new on e-bay (search on "reflow" - the brand I bought is "ATTEN" and it's distributed by a company called "smtpros" if I recall correctly) ... and I've also purchased a toaster oven for the "ez-bake" method ... do a search on Google or Yahoo and you will find a Yahoo group on "ez-bake" with a long thread of useful and informative discussion and hints. Remember, for reflow you need solder *paste* ... available from a number of sources on the web. I prefer the "no clean flux" kind, though I usually clean the boards afterwards anyway ... 73, Carl - wk3c |
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