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#1
September 27th 06, 02:06 AM
posted to rec.radio.cb
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Thought this was puzzling...
"Telstar Electronics" wrote in message ups.com... Frank Gilliland wrote: Wrong. The ceramic package isn't hollow; on the contrary, it contacts more of the junction's surface area than the heat sink flange (which, BTW, doesn't make "intimate contact" with any part of the junction because it is insulated from the die by the Be Oxide substrate). If the ceramic cap is tied so well to the heat source internal to the transistor... then why don't you just attach the heat sink to the ceramic caps on your new design?... LOL www.telstar-electronics.com You're a ****ing idiot dickhead. You simply don't have any common sense. |
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#2
September 27th 06, 02:08 AM
posted to rec.radio.cb
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Thought this was puzzling...
"U-Know-Who" wrote:
www.telSLAP-electronics.com You're a ****ing idiot dickhead. You simply don't have any common sense. He gets to post his free google spam sig with every reply tho.. |
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#3
September 27th 06, 02:16 AM
posted to rec.radio.cb
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Thought this was puzzling...
"Steveo" wrote in message ... "U-Know-Who" wrote: www.telSLAP-electronics.com You're a ****ing idiot dickhead. You simply don't have any common sense. He gets to post his free google spam sig with every reply tho.. But I still love snipping it in my reply. Of course, he'll make another wise and omnipotent statement he |
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