On 31/12/2015 21:20, Roger Hayter wrote:
gareth wrote:


Ugly bug construction requires only a little more space than the devices
themselves.


Well I bow to your superior skills. I have never seen 'dead bug'
construction with SMD passives in large numbers, and four sided IC
packages with sub -millimeter pin spacing. I found just hand-soldering
the DDSs to the multi-layer circuit board sufficient of a challenge!

Not much good when you need low inductance or low cap. circuitry either.

Evans is simply demonstrating his lack of practical experience.