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I have adapted to the "toaster oven" method -- and now I am smt'ng all the
time: my technique is to use an instrument looking like a pick to place a very small dab of solder paste on each of the pads, then place the device using tweezers. it takes about 4 minutes in the toaster oven -- some film capacitors, electrolytics can only be soldered ONCE. my technique is to do all the resistors and ceramic caps first on one run, then do the electrolytics and IC's second, the discrete and non-SMT devices are then soldered in by hand. the method was discussed in Nuts n Volts a few issues ago -- using stainless steel stencils -- I find that I can do it by hand. "Tom Kreyche" wrote in message news:zpgqb.86794$9E1.437033@attbi_s52... I can't avoid it anymore! I have an IC in SSOP package that I want to use. Does anyone have tips on how to do it or maybe this is on a FAQ someplace. thanks, Tom |