2 or 3% silver is added to tin-lead solder to prevent leaching of gold
or silver terminations from certain surface mount components (and the
terminal strips in very old Tektronix scopes). These components are
often used for hybrid circuits, but solder-coated terminations seem a
lot more common for components intended for PCB use. I haven't seen a
leaching problem with the solder-coated terminations using ordinary
tin-lead solder.

Is there some other advantage of a 2 or 3% silver addition?

Roy Lewallen, W7EL

Dave Platt wrote:
. . .

I tend to prefer the eutectic, or a eutectic modified with 2% silver.