Leland C. Scott wrote:
Exactly. That's why those diodes are place on the ceramic cap of the
device and not on the heat sink.

Having the sensing on top of the transistors is a poor location.
The internal die is in intimate contact with the heat sink... not the
top! The heat sink... preferably near the device is the proper location

for any tracking device.

http://auctions.yahoo.com/i:SkyWave%...fier:117239910

"Telstar Electronics" wrote in message
ups.com...
Leland C. Scott wrote:
Exactly. That's why those diodes are place on the ceramic cap of the
device and not on the heat sink.

Having the sensing on top of the transistors is a poor location.
The internal die is in intimate contact with the heat sink... not the
top! The heat sink... preferably near the device is the proper location

for any tracking device.

Are you really that dense?

U-Know-Who wrote:
Are you really that dense?

Thanks for that great post... you really add a lot to any conversation.

www.telstar-electronics.com

On 25 Sep 2006 16:27:30 -0700, "Telstar Electronics"
wrote in
. com:

Leland C. Scott wrote:
Exactly. That's why those diodes are place on the ceramic cap of the
device and not on the heat sink.

Having the sensing on top of the transistors is a poor location.


It's better than the heat sink.


The internal die is in intimate contact with the heat sink... not the
top!


Wrong. The ceramic package isn't hollow; on the contrary, it contacts
more of the junction's surface area than the heat sink flange (which,
BTW, doesn't make "intimate contact" with any part of the junction
because it is insulated from the die by the Be Oxide substrate). The
fact is that a transient pulse can heat and blow the junction before
it can dissipate into the -anything-, which it's more likely to happen
when the transistor is already hot from normal operation.


The heat sink... preferably near the device is the proper location

for any tracking device.


What part of "heat sink" don't you understand?

Frank Gilliland wrote:
Wrong. The ceramic package isn't hollow; on the contrary, it contacts
more of the junction's surface area than the heat sink flange (which,
BTW, doesn't make "intimate contact" with any part of the junction
because it is insulated from the die by the Be Oxide substrate).


If the ceramic cap is tied so well to the heat source internal to the
transistor... then why don't you just attach the heat sink to the
ceramic caps on your new design?... LOL

www.telstar-electronics.com

On 26 Sep 2006 17:15:35 -0700, "Telstar Electronics"
wrote in
. com:

Frank Gilliland wrote:
Wrong. The ceramic package isn't hollow; on the contrary, it contacts
more of the junction's surface area than the heat sink flange (which,
BTW, doesn't make "intimate contact" with any part of the junction
because it is insulated from the die by the Be Oxide substrate).


If the ceramic cap is tied so well to the heat source internal to the
transistor... then why don't you just attach the heat sink to the
ceramic caps on your new design?... LOL


Actually, that's not such a bad idea. Computer processors and other
chips are encased in ceramic and the heat sinks are typically mounted
on top. Having an additional heat sink on the top of the transistor
certainly can't hurt. I'll check into this and see if it's do-able.

Thanks, Brian!

Frank Gilliland wrote:
Actually, that's not such a bad idea. Computer processors and other
chips are encased in ceramic and the heat sinks are typically mounted
on top. Having an additional heat sink on the top of the transistor
certainly can't hurt. I'll check into this and see if it's do-able.

I hate to tell you that processor chips (and some others) are specially
designed to attach the sink on the top... the RF transistors we're
talking about are not.

www.telstar-electronics.com

On 26 Sep 2006 17:29:43 -0700, "Telstar Electronics"
wrote in
.com:

Frank Gilliland wrote:
Actually, that's not such a bad idea. Computer processors and other
chips are encased in ceramic and the heat sinks are typically mounted
on top. Having an additional heat sink on the top of the transistor
certainly can't hurt. I'll check into this and see if it's do-able.

I hate to tell you that processor chips (and some others) are specially
designed to attach the sink on the top... the RF transistors we're
talking about are not.


And Viagra was designed to be a heart medication. What's your point?

Frank Gilliland wrote:
And Viagra was designed to be a heart medication.

I thought it was for male pattern baldness initially.

"Telstar Electronics" wrote in message
oups.com...
Frank Gilliland wrote:
Actually, that's not such a bad idea. Computer processors and other
chips are encased in ceramic and the heat sinks are typically mounted
on top. Having an additional heat sink on the top of the transistor
certainly can't hurt. I'll check into this and see if it's do-able.

I hate to tell you that processor chips (and some others) are specially
designed to attach the sink on the top... the RF transistors we're
talking about are not.

You really are more of moron than thought.