Hi All,

Has anyone attempted to use good old fashioned hot melt glue as an
encapsulant for modules ?

Probably needs melting in a pot over a flame (with appropriate care).

A mould could me made out of Plexiglass with appropriate draft
(angles) and high temperature release agent.

A second thought is to use standard two part fiberglass mix, obviously
a lot more rigid, but potting boxes are likely to be needed also.

I guess I could use thin walled pipe to house a long rectifier stack
and associated capacitors.

Both of these options seem significantly less expensive than standard
epoxy potting compound...

Any thoughts ?

Mark