On Tue, 18 Dec 2007 00:28:58 -0800, MarkAren wrote:

Hi All,

Has anyone attempted to use good old fashioned hot melt glue as an
encapsulant for modules ?

Probably needs melting in a pot over a flame (with appropriate care).

A mould could me made out of Plexiglass with appropriate draft (angles)
and high temperature release agent.

A second thought is to use standard two part fiberglass mix, obviously a
lot more rigid, but potting boxes are likely to be needed also.

I guess I could use thin walled pipe to house a long rectifier stack and
associated capacitors.

Both of these options seem significantly less expensive than standard
epoxy potting compound...

Any thoughts ?

Mark

Im suprised nobody has bothered to ask this....

What is the potting being used for? Moisture, vibration, HV isolation ??

Depending on the use, the 'good enough' alternative might vary
considerably.

--Teh