On Dec 18, 7:28 pm, MarkAren wrote:
Hi All,

Has anyone attempted to use good old fashioned hot melt glue as an
encapsulant for modules ?

Probably needs melting in a pot over a flame (with appropriate care).

A mould could me made out of Plexiglass with appropriate draft
(angles) and high temperature release agent.

A second thought is to use standard two part fiberglass mix, obviously
a lot more rigid, but potting boxes are likely to be needed also.

I guess I could use thin walled pipe to house a long rectifier stack
and associated capacitors.

Both of these options seem significantly less expensive than standard
epoxy potting compound...

Any thoughts ?

Mark

Epoxy, as described by others, tends to stress the components - one
notable job I had was the vco in a Yaesu FT480R - took AGES to chip
away with a fine wood chisel after using a blowtorch to open up the
brass enclosure.....one of those "personal challenge" jobs.

I use good old fashioned beeswax. Good rf properties, easy to use,
easy to dig out if needed. Bugger all mechanical strength, but ideal
for vibration damping ie oscillators etc. Repotted the Yaesu VCO, no
reported problems after 3 years....

Andrew VK3BFA.